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Dale P. Barkey

Affiliations: 
University of New Hampshire, Durham, NH, United States 
Area:
Chemical Engineering, Materials Science Engineering
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"Dale Barkey"
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Aiwen Wu grad student 2003 UNH
Zhongqin Zhang grad student 2004 UNH
Ashleigh Kreider grad student 2012 UNH

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Publications

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Hemmati S, Harris MT, Barkey DP. (2020) Polyol Silver Nanowire Synthesis and the Outlook for a Green Process Journal of Nanomaterials. 2020: 1-25
Barkey D, Oberholtzer F, Wu Q. (2019) Kinetic anisotropy and dendritic growth in electrochemical deposition. Physical Review Letters. 75: 2980-2983
Lu J, Barkey DP. (2018) A Thermodynamic Study of Adsorption of Benzyl Viologen and Polyethylene Glycol and Their Displacement by 3-Mercapto-1-Propanesulfonate during Copper Electrodeposition Journal of the Electrochemical Society. 165
Hemmati S, Barkey DP, Gupta N, et al. (2015) Synthesis and characterization of silver nanowire suspensions for printable conductive media Ecs Journal of Solid State Science and Technology. 4: P3075-P3079
Barkey D, Chang R, Liu D, et al. (2014) Observation of a Limit Cycle in Potential Oscillations during Copper Electrodeposition in a Leveler/Accelerant System Journal of the Electrochemical Society. 161
Kreider A, Barkey DP, Wong EH. (2014) On the displacement of adsorbed polyethylene glycol by 3-mercapto-1-propanesulfonate during copper electrodeposition Journal of the Electrochemical Society. 161: D663-D665
Garcia-Cardona E, Wong EH, Barkey DP. (2011) NMR spectral studies of interactions between the accelerants SPS and MPS and copper chlorides Journal of the Electrochemical Society. 158: D143-D148
Zhang Z, Barkey DP. (2007) Nucleation of Tin and Tin–Silver Alloy on Copper and Nickel in Acid Plating Baths Journal of the Electrochemical Society. 154
Kondo K, Yonezawa T, Mikami D, et al. (2005) High-Aspect-Ratio Copper-Via-Filling for Three-Dimensional Chip Stacking II. Reduced Electrodeposition Process Time Journal of the Electrochemical Society. 152: 173-177
Pasquale MA, Barkey DP, Arvia AJ. (2005) Influence of Additives on the Growth Velocity and Morphology of Branching Copper Electrodeposits Journal of the Electrochemical Society. 152
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